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Semiconductor Packaging Is No Longer 'Standard'

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_hm
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Packaging and product life cycle
_hm   2/16/2014 9:34:51 AM
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Product life cycle also has reduced a lot. And it is easy to design new product with new compact packaging.

Standard packging and multi source availability is slowly disappearing expcept for defense electronics. As designer do not spend much time for this effort. It may be futile.

Also for industry like defense who needs 15 years of life cycle, it is good business ofr vendor to repackage and sale at much higer cost. Lots of profit.

 

ddeisz
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Production Synthesizer
Re: Packaging and product life cycle
ddeisz   2/19/2014 3:46:36 PM
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Standard Packaging and multi-source availability has left all markets for new digital products. Defense Electronics is no exception.

Hailey Lynne McKeefry
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Re: Packaging and product life cycle
Hailey Lynne McKeefry   2/23/2014 3:13:31 PM
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@ddeisz, Do you think that this trend of lack of standardization and multiple sources is one that can be shifted or is it just a new reality and we have to evolve to work with the contraint?

ddeisz
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Re: Packaging and product life cycle
ddeisz   2/23/2014 3:57:58 PM
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Hailey - new reality. Commercial pressures for differentiation for most digital electronics will keep them away from anything standard.

Hailey Lynne McKeefry
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Re: Packaging and product life cycle
Hailey Lynne McKeefry   2/25/2014 12:02:33 PM
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@ddeiz, that makes total sense. The digital electronics market is fast-paced and more competitive than ever before. The ever changing nature of the products is a two-edged sword though. Every apple i-product i have has a different connector--and its' annoying. Maybe consumer uprising will slow things down a bit... but probably not.

Hailey Lynne McKeefry
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Re: Packaging and product life cycle
Hailey Lynne McKeefry   2/23/2014 3:11:55 PM
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_hm, good for the vendor, but really hard for the procurement professional and even the designer.

t.alex
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Re: Packaging and product life cycle
t.alex   2/25/2014 8:49:23 AM
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The push is in fact coming from end-customers, who always wish for smaller, better, thinner products.

FLYINGSCOT
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too true
FLYINGSCOT   2/18/2014 10:32:27 AM
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I could not agree more.  Packaging is doubly important these days as it is oftentimes more expensive than the silicon inside and it also can be critical to achieving the necessary product specification.

t.alex
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Re: too true
t.alex   2/21/2014 8:57:48 AM
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It's definitely no longer a standard. It is in fact a competitive advantage feature.

SP
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Re: too true
SP   2/22/2014 1:25:07 PM
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Packaging obsolescence is one of the big issue in design. The cost involved in respinning the PCB layouts with available package can prove costly and time consuming. But is it correct if Rochester electronics are working towards solving this problem.

catheriene
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Stock Keeper
well said
catheriene   3/11/2014 9:53:53 AM
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