SAN JOSE, Calif. – Here's a heads-up on six things to expect at next week's Flash Memory Summit in Silicon Valley. The annual event has been growing in parallel with the rise of NAND flash chips that are plugging into an increasing variety of sockets in consumer and business systems.
1. Expect more details on vertical NAND. Samsung grabbed headlines last year when it unveiled the design of a 24-layer stacked 128 Gbit NAND chip. The chips are now shipping from Samsung. Others including SanDisk and Toshiba are jumping on the bandwagon of vertical NAND as the next big step in the flash roadmap.
The same Samsung execs who rolled out vertical NAND last year are back for a keynote next week. Expect incremental news about their work in the technology.
The IPSO Alliance is planning to publish a specification for building an IoT software stack using Internet Protocol. The announcement is part of a movement to bring standards to the Internet of Things.
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