NEW YORK CITY – Taiwan Semiconductor Manufacturing Co. (TSMC) began shipping mobile processors to Apple during the second quarter of this year and will continue through 2015, the Wall Street Journal reported.
"Apple makes all of its suppliers sign a vow of silence," said Nathan Brookwood, principal of market watcher Insight64. "There have been consistent rumors over the past year that Apple is going to turn to TSMC for the next microprocessor that's going to be used in the iPhone 6, which is rumored to come out in September."
Although the reports haven't been substantiated by either company officially, TSMC reportedly signed a deal with the iPhone maker last year to supply processors using its FinFET process at the 16- and 10-nm nodes, after beginning with 20-nm planar CMOS. Until now, Apple's mobile SoCs have been made solely by archrival Samsung, which Apple sued for infringement of its iPhone and iPad patents.
For the full story, see EBN's sister site, EE Times.
— Jessica Lipsky is an associate editor at EE Times.
"Until now, Apple's mobile SoCs have been made solely by archrival Samsung, which Apple sued for infringement of its iPhone and iPad patents."
I thought companies didn't really get to know suppliers until they sue them. All that legal discovery must be a great way to get commercially intimate. But, supplier monogamy is considered a risk in the supply chain, or so I've heard.
Hardware designed specifically for wearable devices will be key to mainstream products. Panelists at Linley Tech Mobile Conference said scaled-down smartphone SoCs are preventing the battery life improvements necessary for wearables to take off.
Prototyping applications will be key to Google Glass and other wearable glasses, according to speakers today at Wearables DevCon, a conference for wearable makers, software developers, and app creators.
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