Design Con 2015

Multidimensional Effective 3D-IC Cost Management

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David Park
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Re: data overload
David Park   8/26/2014 4:43:00 PM
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Hi Flying Scot, thanks for your comments. Actually it doesn't require any more data than is generated today, but the analysis of the data is significantly more involved. Applying only good die/bad die information to 3D-IC is not enough to ensure quality end products. We need to use manufacturing data more proactively to establish a range of "goodness" that will enable better pairing of devices in multi-chip packages. This is the "big data" challenge. The data already exists to do this, but the ability to mine that data to determine what die will work best with what other die is now the challenge.

FLYINGSCOT
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data overload
FLYINGSCOT   8/3/2014 10:52:51 PM
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There is a huge implication in the amount of data to be supplied with each IC to ensure it is cimpatible with the other chips it is paired with.  Normally we only look for marked good/bad die but no the good die will have to come with a ton of data also.

nimantha.d
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Re: good article
nimantha.d   7/31/2014 6:33:54 AM
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Thank you for sharing it david. Was very useful. 

Himanshugupta
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good article
Himanshugupta   7/31/2014 4:17:24 AM
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Thanks David for putting down the summary of problems and way forward for 3D-IC stacks. 3rd dimension is the way forward to keep Moor's law alive but going that route has a lot of challenges. I have not seen people putting down the challenges in such a consolidated manner as you have done in this article.



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