BANNOCKBURN, Ill. -- IPC — Association Connecting Electronics Industries is pleased to announce the winning research papers selected in the 2012 IPC International Academic Paper Competition:
Low Temperature Lead-Free Assembly Via Transient Liquid Phase Sintering, by Joseph Flanagan, Purdue University; Measurement Study for Cross Section Versus X-ray Inspection, by Loc Nguyen, San Jose State University; Solder Fillet Height Workmanship Criteria for Castellated Solder Joints, by Tim Pearson, Iowa State University.
The authors of these papers will present their research at a free BUZZ session on Thursday, March 1, 2012, at IPC APEX EXPO in San Diego.
Open to all accredited U.S. and international colleges and universities with a strong focus on the electronics industry, this year’s competition welcomed entries from around the world. The paper abstracts were judged by an IPC blue ribbon committee.
Industry professionals may register online for free exhibit hall registration and attend this session and other educational BUZZ sessions. IPC APEX EXPO is the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test.
EBN Dialogue enables and encourages you to participate in live chats with notable leaders and luminaries. Not only editors and journalists, but the entire EBN community is able to comment and ask questions. Listed below are upcoming and archived chats.
Archived Dialogues
Thailand Stages a Comeback Join EBN contributor Jennifer Baljko on Thursday August 23, 2012, at 11:00 a.m. EST for a live chat on how electronic manufacturers in Thailand have shored up their supply chain to reduce the impact of future natural disasters.
Euro-Crisis: What It Means for High-Tech Firms Join EBN Editor in Chief Bolaji Ojo and Contributing Editor Jennifer Baljko on Thursday, July 12, at 10:00 a.m. EDT for a Live Chat on high-tech and Europe's economic difficulties.
Microsoft Surface: Potential Winners & Losers What are the implications for the electronics industry supply chain of Microsoft Corp.'s decision to launch its own tablet PC? Join industry veteran and EE Times' systems and OEM expert Rick Merritt on Tuesday, July 3, at 12:00 pm EDT for a Live Chat on this subject.
Join EBN contributor Jennifer Baljko on Thursday August 23, 2012, at 11:00 a.m. EST for a live chat on how electronic manufacturers in Thailand have shored up their supply chain to reduce the impact of future natural disasters.
Peter Drucker famously said "Trying to predict the future is like trying to drive down a country road at night with no lights while looking out the back window." Yet in the razor's-edge world of electronics—with a lean supply chain and just-in-time demands—the need to know the future is vital.
While no one really can accurately predict the future, we can take guidance from another Drucker saying which is the best way to predict the future is to create it.
You've heard the saying "the No. 1 supply chain risk is your people." That hasn't always been the case. But today's complex global supply chain requires a new type of multitalented employee. It's one who understands, finance, marketing, economics, is savvy with technology, graceful with relationships and can think analytically.
Where are these people? Are universities properly preparing the next generation supply chain professionals? How do train your existing workforce for these new, demanding positions?
Brian Fuller, editor-in-chief of EBN, will lead a 60-minute Avnet Velocity panel discussion that will ask and answer these and other questions swirling around today's supply-chain talent challenges.
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