ETTERS, PA. — FCI, a leading supplier of power products and interconnect systems, and 3M have entered into a second-source agreement covering the High Power Card Edge (HPCE®) and HP2 power product families.
The HPCE connector is a next-generation power card edge connector for demanding applications requiring high linear current density and low power loss. HPCE offers a low profile height (2.8 mm for straddle mount and 7.5 mm for right angle) and is based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from FCI.
The HPCE connector incorporates an innovative power contact and housing design that permits a more compact and lower profile package for demanding AC and DC power supply and/or add-in card applications. HPCE’s low profile height (for maximized airflow), significantly increased linear current density and low contact resistance characteristics are ideal for next generation 1U/2U servers, storage enclosures, telecommunications equipment and datacom/networking equipment.
The innovative HPCE cable-to-card edge is available with the same desirable features as the standard HPCE board mount product but is focused on power distribution applications via cabling. It includes high power (10 – 14 AWG wire) and low power (14 – 16 AWG wire) contact options as well as integrated signal contacts (22 – 26 AWG wire). The modular tooling approach maximizes flexibility to meet a wide range of power distribution requirements including bus bar attachment. The integrated latching option makes it ideal for high shock-and-vibration environments.
The HP2 product is similar to HPCE but utilizes a two-piece design (header-to-receptacle connectors/cable assemblies). Integrated guide features make it ideal for blindmate applications where system guidance is not readily available. The HP2 product is available in board-to-board and cable-to-board configurations and includes power contacts for power distribution and signal contacts for power control.