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Academics to Present at IPC Apex Expo 2012

BANNOCKBURN, Ill. — IPC — Association Connecting Electronics Industries is pleased to announce the winning research papers selected in the 2012 IPC International Academic Paper Competition: Low Temperature Lead-Free Assembly Via Transient Liquid Phase Sintering, by Joseph Flanagan, Purdue University; Measurement Study for Cross Section Versus X-ray Inspection, by Loc Nguyen, San Jose State University; Solder Fillet Height Workmanship Criteria for Castellated Solder Joints, by Tim Pearson, Iowa State University.

The authors of these papers will present their research at a free BUZZ session on Thursday, March 1, 2012, at IPC APEX EXPO in San Diego.

Open to all accredited U.S. and international colleges and universities with a strong focus on the electronics industry, this year’s competition welcomed entries from around the world. The paper abstracts were judged by an IPC blue ribbon committee.

Industry professionals may register online for free exhibit hall registration and attend this session and other educational BUZZ sessions. IPC APEX EXPO is the largest exhibition in North America for printed board design and manufacturing, electronics assembly and test.

IPC

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