Seabrook, NH (PRWEB) July 28, 2016
Cutting edge datacenters and communications networks utilizing high speed optical ICs need interposers that can handle increasing data rates out to 32Gbps. With the growth of Internet of Things and increased data analytics, the need for engines and components that can handle this bandwidth growth becomes paramount.
Ardent Concepts, Inc. has answered this need by adding to its CA Series; 32Gbps OEM optical connectors designed to your needs and delivered with short lead times. Ardent’s proven technology satisfies extremely high node count requirements without extreme force. With contact heights as low as .030”, stack ups can be reduced without sacrificing signal integrity.
The scalability of Ardent’s CA Series technology is enabling the next generation of optical device IC manufactures to allow for solderless high speed optical Electrical Modules. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
“Many of our customers are building large scale systems and need to plan for future optical module upgradability and/or replacement. In the past, most data transmission modules were soldered down in manufacturing and required expensive rework to introduce new designs or replace faulty modules,” said Ardent President and Chief Technology Officer, Gordon Vinther.
About Ardent Concepts
Ardent Concepts is a leading designer and manufacturer of high performance multicoax assemblies, probes, connectors, and sockets used in the development of next generation semiconductors and electronics systems. Our core technology is the smallest, fastest, most electrically efficient compression mount connector technology worldwide. It is used to connect: integrated circuits and printed circuit boards to instrumentation and to each other offering superior signal integrity in a high speed environment. Markets for our products include: Semiconductor, Test & Measurement, Military/Aerospace, Communications and Medical. http://www.ardentconcepts.com.