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ASPENCORE Double Summits opens today with Global CEO Summit & World Electronics Achievement Awards ceremony

Shenzhen—  AspenCore, the world’s leading media group within the technical electronics sector, today launched its two-day Double Summits in Shenzhen, China’s most innovative city. The event is composed of today’s Global CEO Summit and World Electronics Achievement Awards ceremony, as well as Global Distribution and Supply Chain Leader Summit and Global Electronic Component Distributor Awards to be held tomorrow. An exhibition is held concurrently with the summits.

“We at ASPENCORE are committed to fostering innovation in the electronics industry through providing high-quality content and creating an environment conducive to interaction among technology providers and engineers designing end-products,” said Yorbe Zhang, Head of ASPENCORE APAC. “We are honored to have such an international speaker lineup, and livestreaming enables participants from around the world to benefit from their speeches. This event is meant to be the beginning of a global conversation on the future of electronics innovation.”

At the Global CEO Summit, 11 prominent leaders and CEOs from the semiconductor and technology sector share their insights on AI, IoT, 5G and automotive electronics. They are:

  • Dr. Wei Shaojun, President, IC Design Branch, China Semiconductor Industry Association
  • Victor Peng, President & CEO, Xilinx
  • Jean-Marc Chery, President & CEO, STMicroelectronics
  • Tyson Tuttle, CEO, Silicon Labs
  • Nicky Lu, CEO, Etron Technology; President, Taiwan Semiconductor Industry Association
  • Paul Boudre, CEO, SOITEC
  • Maurice Geraets, Managing Director NXP Netherlands & Vice President Innovation
  • Allen Wu, Executive Chairman and CEO, Arm China
  • José Franca, Partner, Keensight Capital; Full Professor, Instituto Superior Técnico; Founder, Chipidea; Former State Secretary of Education, Portugal
  • Wayne Dai, Chairman, President & CEO, Verisilicon
  • Luca Verre, CEO, Prophesee

Their inspiring speeches were followed by a roundtable discussion moderated by Junko Yoshida , Global Co-Editor-in-Chief of ASPENCORE, on “China, the World & the Next Big Technologies”. Panelists included Jerry Fan, President, Analog Devices China; James Liu, Vice President and General Manager China, Imagination Technologies; Jack Qi Shu, Executive Vice President, HLMC; David X D Yang, Chairman and CEO, ZGMicro; and Sassine Ghazi, co-General Manager Design Group, Synopsys

Unveiling 2018 World Electronics Achievement Awards winners

ASPENCORE’s World Electronics Achievement Awards (WEAA) program honors companies, executives and technologies that have made outstanding contributions to innovations and development in the electronics industry worldwide. Winners are selected by a judging panel comprising ASPENCORE editors in Asia, the US and Europe, as well as through online voting by engineers across the world. The 2018 winners are:

Editors’ Choice and Company Awards

  • Executive of the Year – Tyson Tuttle, President and CEO, Silicon Labs
  • Contributor of the Year – Wei Shaojun, Chairman, IC Design Branch, CSIA
  • Innovator of the Year – Victor Peng, President and CEO, Xilinx
  • Executive of the Year, APAC – Jerry Fan, President, ADI China
  • Innovator of the Year, APAC – Wayne Dai, Chairman, President and CEO, VeriSilicon
  • Company of the Year – Analog Devices, Inc.
  • Promising New IoT Technology of the Year – Arm Cortex-M35P Protect you from physical attack (Arm Technology (China) Co., Ltd)
  • Promising New AI Technology of the Year – NVIDIA DRIVE Xavier (NVIDIA)
  • Top Finished Electronics Product of the Year – Huawei P20 Series
  • Start-up Technology of the Year – PROPHESEE
  • Top Design Team of the Year – Arm China Ecosystem Engineering Team (Arm Technology (China) Co., Ltd) 
  • Industry Association of the Year – Shanghai Integrated Circuit Industry Association
  • Top Blogger of the Year – Gao Ge

Innovative Product of the Year Awards

(winners in each category listed in alphabetical order of company names)

Sensor of the Year

  • AS7221 (ams AG)
  • NXP 77GHz Radar Solutions (NXP Semiconductors)
  • Smart Wireless Monitoring Accelerometer (TE Connectivity)

Amplifier/Data Converter of the Year

  • AD9208/AD9172 28nm CMOS ADC/DAC Chipset (Analog Devices, Inc.)
  • ADC12DJ3200 (Texas Instruments)
  • High-Definition 4-Channel Audio ADC – AC108 (X-Powers)

RF/Wireless/Microwave Product of the Year

  • DA14586 Bluetooth 5.0 SoC (Dialog Semiconductor)
  • EFR32xG13 Wireless Gecko (Silicon Labs)
  • WS9638 (Zgmicro Corporation)

Processor/DSP/FPGA of the Year

  • Snapdragon 845 Mobile Platform (Qualcomm)
  • VC0718P SVAC NPU Processor (Vimicro AI Chip Technology Corporation)
  • Zynq UltraScale+ RFSoCs (Xilinx)

Microcontroller/Interface of the Year

  • GD32 MCU (GigaDevice)
  • ATA65XX Family (Microchip Technology Inc.)
  • Renesas world’s first 28nm MCU, the RH850/E2x (Renesas Electronics China)

Memory of the Year

  • 88NR2241 intelligent NVMe switch (Marvell)
  • Ferri-UFS (Silicon Motion, Inc.)
  • 1.2V Serial NOR Flash (Winbond Electronics Corporation)

Power Semiconductor/Driver of the Year

  • ASSR-601J (Broadcom Inc.)
  • SGM37604A (SG Micro Corp)
  • Toshiba LV MOSFET (Toshiba Electronics (China) Co., LTD.)

Power Management/Voltage Converter of the Year

  • LTM4661 15V, 4A µModule Boost Regulator (Analog Devices, Inc.)
  • MP2888A Industry First 10 Phase Digital Controller (Monolithic Power System, Inc)
  • PVxx-29Bxx Series (MORNSUN Guangzhou Science & Technology Co., Ltd.)

High Performance Passive Component of the Year

  • CeraChargeTM , PowerHapTM (EPCOS (China) Investment Ltd - A TDK Group Company)
  • Sliver SFF-TA-1002 Interconnects (TE Connectivity)
  • 225 EDLC-R ENYCAPTM Storage Capacitors (Vishay Intertechnology, Inc.)

Test & Measurement Product of the Year

  • PXIe-5820 (National Instruments)
  • R&S®RTP Series Digital Oscilloscope (Rohde & Schwarz (China) Technology Co., Ltd)
  • 5 Series MSO Mixed Signal Oscilloscope (Tektronix)

EDA/IP of the Year

  • Cadence Virtuoso System Design Platform (Cadence Design Systems, Inc.)
  • PowerVR Series2NX (Imagination Technologies)
  • Synopsys Fusion Technology (Synopsys Inc)

Software/Tool of the Year

  • IPsense (Cellixsoft Corporation)
  • Siemens PLM Software Autonomous Driving Solution (Siemens PLM Software)
  • AI Innovation Solutions (Synopsys Inc)

9 comments on “ASPENCORE Double Summits opens today with Global CEO Summit & World Electronics Achievement Awards ceremony

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