|

Hybrid Modules Create Next Chip Packaging Revolution

Page 1 of 3 Next >
View comments: newest first | oldest first | threaded
sranje
User Rank
Stock Keeper
Thank you - very helpful - but
sranje   12/5/2017 5:27:55 PM
NO RATINGS

Samsung is making DRAM DIMM boards with each of the 8-9 memory packages having multiple DRAM dies --- connected by TSV Is this not one of the solutions??  Many thanks



More Blogs from Jim O'Reilly
Solid state drives are pushing hard disk drives into potentially being just a technology in our memories.
What is the Brave New World of sophisticated technology going to look like? Only time will tell, but we can make an educated guess.
All of a sudden, huge solid state drives are available, for a price. Even before prices go down, they may make sense in certain applications.
When we do the math, failure rates are likely to ground delivery by drone before it ever really takes off.
Twitter Feed
EBN Online Twitter Feed
EBN Dialogue / LIVE CHAT
EBN Dialogue enables you to participate in live chats with notable leaders and luminaries. Open to the entire EBN community of electronics supply chain experts, these conversations see ideas shared, comments made, and questions asked and answered in real time. Listed below are upcoming and archived chats. Stay tuned and join in!
Archived Dialogues
Live Chat 01/15: CPOs Re-Shape Their Business Roles
Increasingly chief procurement officers (CPOs) are re-shaping their organizational role to focus on creating results far beyond cost controls. A new IBM survey explores how.
Live Chat 11/12: Examining the Cyberthreat to Supply Chains
The number of cyberattacks is on the rise and hackers are targeting the supply chain. Drew Smith, founder and CEO of InfoArmor, will be on hand to discuss the reality of today's threat landscape and what to do about it.