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Avnet Adds Endicott

PHOENIX — Size, weight and power (SWaP) reductions are critical design factors for many of today’s defense, aerospace and medical applications.

Endicott Interconnect Technologies, Inc. (EI) is a leading developer of system-in-package (SiP) technical solutions that combine multiple integrated circuits (ICs), assembly and test technologies into high reliability modular IC packages. As the latest addition to the Avnet Electronics Marketing Americas line card, EI provides a powerful combination of CoreEZ® organic substrates and high performance HyperBGA® semiconductor packages to Avnet Electronics Marketing customers throughout the Americas.

“Avnet provides impressive design chain services to an expansive portfolio of customers in the aerospace and defense markets,” said Michael J. Hills, senior vice president of sales and marketing for Endicott Interconnect Technologies, Inc. “Collectively, we will offer highly reliable SWaP reduction solutions early in the design phase, which will shorten cycle times and bring the most competitive products to market faster.”

“Engineers, specifically in the mil/aero and medical industries, are looking for new ways to significantly reduce SWaP and gain a true competitive advantage,” said Bryan Brady, vice president, director of defense and aerospace for Avnet Electronics Marketing Americas. “The combination of Avnet’s FPGA/ASIC design capability and EI’s substrate and packaging expertise enables Avnet to provide game changing system-in-package solutions to our defense, aerospace and medical customers.”

EI products meet ISO, IPC and military specifications, RoHS compliance, ITAR registration and are compatible with lead free assembly processes.

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