GREENWOOD VILLAGE, Colo. — Advancements in Thermal Management 2010 is a technical symposium for design engineers and product developers looking to push the capabilities of their electronics designs. Being held on Oct. 19th, 2010 at the Gaylord Texan in Dallas, Texas, this event will feature presentations on the latest advancements in thermal management and thermal technology for electronics packaging and cooling, temperature sensing and control, thermal materials, systems design and management for optimizing thermal properties.
“Designing electronics with high power needs and processing power is taxing the limits of thermal management and protection technology,” said Nick Depperschmidt, program chairman. “Because of this, engineers must stay up-to-date on the latest advancements in this rapidly changing field. Attendance at Advancements in Thermal Management 2010 will provide that kind of educational experience.”
According to a study from BCC Research, the value of the global market for thermal management technologies is an estimated $7.5 billion in 2010, but is expected to increase to $10.2 billion in 2015, for a five-year compound annual growth rate (CAGR) of 6.4 percent. In recent years, there has been tremendous progress, technologically and in terms of demand, in electronic devices and systems. According to BCC, the technological progress has come on two main fronts, increased functionality on a single device unit and miniaturization of each unit. Both of these developments have increased the need for thermal management technology.
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