Design Options for Next Billion IoT Devices

TOKYO – We’ve all heard enough about the 20 to 50 billion connected devices that are supposed to flood the market by 2020. On one hand, the big numbers expected for the emerging Internet of Things (IoT) market have stirred hope in the semiconductor industry. On the other, many chipmakers are feeling IoT fatigue before the promised market is born.

Sanjay Jha, CEO of Globalfoundries came to the Shanghai FD-SOI Forum last week, and told the audience that it’s time for the industry to define IoT. More important, he said that the industry must develop realistic strategies to meet the technical requisites of IoT devices.

Among a surfeit of theories, predictions and technology horse-race stories on IoT, it’s time to hear from someone who has actually done the due diligence, made design choices and developed his own new IoT chipset.  

Satish Bagalkotkar

Satish Bagalkotkar

Meet Satish Bagalkotkar, CEO, Synapse Design. He came to Shanghai last week attending the same conference where Jha was a keynote speaker. Bagalkotkar came to speak of his own IoT chipset design. He defines IoT devices as “almost free,” with a multi-year battery life and a very small foot print while featuring “world-wide connectivity.” 

Following these parameters, he sought 18 months ago a chip solution to enable a sub-$5 finished product, with average power consumption at less than 100mA.

“We wanted to make sure that the IoT device survives on a coin battery,” said Bagalkotkar. The module had to be “inconspicuous,” as it is there to track location, temperature, pressure and other data, he said. The design goal was also set to enable worldwide connection via LTE.

To read the rest of this article, visit EBN sister site EE Times.


2 comments on “Design Options for Next Billion IoT Devices

  1. mesetudes
    September 22, 2015

    Didn't know this activities, thanks

  2. catholique
    October 1, 2015

    I assisted to Meet Satish Bagalkotkar conference and it was realy interesting.

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