The research study covers the present scenario and growth prospects of the global 3D semiconductor packaging marketfor 2016-2020. The report lists two segments based on application, which are consumer electronics and others with the consumer electronics segment accounting for 91% of the market share.
Technavio hardware and semiconductor analysts highlight the following three factors that are contributing to the growth of the global 3D semiconductor packaging market:
· Increasing adoption of copper wire bonding
· Need to control chip design costs
· Emergence of advanced consumer products
Increasing adoption of copper wire bonding
The increasing requirement for cost-effective and efficient semiconductors is driving the demand for 3D semiconductor packaging market. The use of copper wires instead of conventional gold wires in chips during 3D semiconductor packaging allows vendors to reduce their costs significantly. This results in increasing demand for 3D semiconductor packaging with copper wire bonding in the global market.
Need to control chip design costs
The increasing complexity of designing electronic devices that are required to implement technologies such as the Internet of Things (IoT) is causing a rapid increase in their designing costs. High designing costs are restricting semiconductor device manufacturers from adopting aggressive pricing strategies. “In order to control their design costs and to ensure effective manufacturing of designs on the drawing board, companies such as Samsung are increasingly adopting 3D semiconductor packaging. This is likely to drive the growth of the global 3D semiconductor packaging market during the forecast period,” says Asif Gani, a lead analyst for semiconductor equipment research at Technavio.
Emergence of advanced consumer products
The consumer electronics market has undergone massive transformations since 2011. Smartphones replaced feature phones, laptops replaced PCs, LEDs and smart TVs replaced cathode ray tube TVs, and tablets are replacing laptops. Presently, manufacturers and application developers are attempting to take this transition further by interconnecting all these household devices and creating a single unit called a smart home, which can be controlled by applications installed on a smartphone. With rapid technological advances and growing demand for better electronics, manufacturers are focusing on offering consumer products with improved functionalities.
Such upgrades in consumer offerings will require the use of robust technology. 3D semiconductor packaging techniques such as TSV are the core of integrated chip packaging on a nanometer scale, thereby ensuring robust hardware for technology. TSV ensures 3D stacking with short vertical interconnects to improve signal and reduce power dissipation and power consumption. Technavio expects that the emergence of advanced consumer products will drive the growth of the 3D semiconductor packaging market during the forecast period.
Shipments of smartphones are likely to reach more than 2 billion units by 2020, and tablets too, have also registered significant growth in their shipments from just 20 million units in 2010 to 206 million in 2015. “This optimistic growth in advanced consumer products augurs well for the growth of the 3D semiconductor packaging market,” says Asif.