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Future to Distribute Redpine

SAN JOSE, Calif. — Future Electronics, today announced a global distribution agreement with Redpine Signals, Inc., for Redpine’s broad portfolio of wireless chipsets, modules and development kits. Future will distribute Redpine Signals’ complete portfolio of low-power, high-performance IEEE 802.11abgn chipsets and modules that address multiple market segments including industrial, consumer electronics, medical, mobile, PC, smart energy and others. Redpine’s modules provide seamless connectivity to any microcontroller platform available today and the distribution agreement also includes development kits that enable easy integration of Wi-Fi into microcontroller based embedded systems.

“Future’s engineering expertise, global support infrastructure, and extensive customer portfolio couple ideally with Redpine’s differentiated Wi-Fi solutions to address the explosively growing embedded wireless market,” said Venkat Mattela, Chief Executive Officer of Redpine Signals. “We expect this partnership to ideally address the design and deployment of the upcoming wave of interconnected devices – the Internet of Things,” he added.

“Entering into this partnership with Redpine is an exciting step for us,” said Frantz Saintellemy, Corporate Vice-President and CTO of Future Electronics. “Wi-Fi is an important piece of a large number of new designs built with the array of microcontrollers from multiple vendors that we offer, and Redpine’s Wi-Fi products enable our engineering groups to present solutions to our customers’ connectivity requirements in multiple industry verticals,” he added.

{complink 2164|Future Electronics}

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