Micron Moves 3D NAND Into Mobile

TORONTO—Until recently 3D NAND has been only hitting the market within SSDs, but now Micron Technology said it's ready for mobile devices.

Last week the company introduced its first 3D NAND memory technology optimized for mobile devices and its first products based on the Universal Flash Storage (UFS) 2.1 standard. Micron's first foray into mobile 3D NAND is a 32GB offering aimed at the high and mid-end smartphone segments, which make up approximately 50% of worldwide smartphone volume, said Gino Skulick, VP of marketing in Micron's mobile business unit in a telephone interview with EE Times. The company is sampling the new 3D NAND with mobile customers and partners, and it will be widely available by the end of 2016.

Continue Reading on EE Times.

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