Nanium & UTAC Partners on Wafer Level Packaging & Testing

The collaboration will yield a full turnkey solution comprising of Nanium's full suite of wafer level packaging / bumping services, complemented by UTAC's backend assembly and test services.

“Through this collaboration, we will be able to offer joint customers a seamless solution comprising Nanium's superior solutions and UTAC's assembly and test capabilities spread across a wide manufacturing base in Asia,” said in a statement Mr. Asif Chowdhury, UTAC Senior Vice President of Product Line & Marketing.

UTAC's strong base of more than 1600 test platforms across Asia will expand Nanium's reach globally. According to research house Yole Development (2015), the overall WLP market is projected to grow at a compound average growth rate of 9%, and the FOWLP (a subset) is predicted to have a 30% compound average growth rate 2016 to 2020.

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This article originally appeared on EETimes Europe. 

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