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Nano Dimension Explores the Future of 3D Printed Electronics at formnext 2016

NESS ZIONA, Israel  – Nano Dimension Ltd., a leader in the field of 3D Printed Electronics (NASDAQ, TASE: NNDM), will be a featured speaker at formnext 2016 in Frankfurt, Germany, November 15-18, 2016. The company will also demonstrate its highly anticipated 3D printing platform for the production of professional multilayer PCBs and 3D circuitry. 

News Highlights:

  • Simon Fried, Co-Founder and Chief Business Officer of Nano Dimension, will present on the main stage at 11:30 on Friday, November 18, 2016. Mr. Fried will discuss the challenges and benefits of 3D printing for PCBs and 3D circuitry, as well as the future outlook for 3D printed electronics.
  • Nano Dimension will also be exhibiting in Hall 3.1, Stand B60F.  The company will demonstrate its DragonFly 2020™ 3D Printer – the world's first 3D printer designed for the production of professional multilayer PCBs – which was delivered to customers in Israel and the U.S. in the third quarter.
  • The company has also started to 3D-print circuits beyond PCBs, including antennas, molded interconnect devices (MIDs), and more. Visitors to the booth will be able to see a wide range of PCB and circuit samples printed by the DragonFly. 

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