ORLANDO, Fla.—The Trillion Sensor Summit 2015 (here, Dec. 9-10) celebrated the dominance that sensors are enjoying in a world being flooded with sensor-studded smartphones and other smart devices—not just micro-electro-mechanical system (MEMS) sensors anymore—but a whole array of semiconductor sensors that have spun-off from MEMS. The Trillion Sensor (TSensor) Summit, founded by serial entrepreneur Janusz Bryzek, was organized for the first time this year by the newly renamed MEMS & Sensor Industry Group (formerly MIG).
(Source: EE Times)
“For decades, sensors were on sidelines of the semiconductor industry,” Bryzek said in his opening remarks to the Trillion Sensor Summit. “Apple's iPhone changed all that, triggering a sensor tornado of 10 million MEMS sensors in 2007—the year of the iPhone's introduction—that has grown to 15 billion sensors in 2015.”
Two years ago, Bryzek promised a roadmap document that would accurately plot the path that the explosive growth of sensors would make on the way to one trillion by 2025. However, his methodology proved ineffective, prompting him and his collaborators to split the project into two parts, both under Bryzek's supervision.
The first part will focus on sensors and their applications and will be produced from about 150 white papers on devices and applications drawn from the 275 presenters at this and former TSensor Summits. Bryzek estimates that it will take six to 12 months to produce his free online searchable sensor and applications roadmap.
Meanwhile, the second part of the roadmap focuses on systems and infrastructure and will be produced in cooperation with The Micro and Nano Technology Commercialization Education Foundation (MANCEF) under the tutelage of Steve Walsh a member of the Micro and Nano Technology Commercialization Education Foundation's Executive Board and co-founder of the organization with Bryzek.
(Source: Steven Walsh at MANCEF, used with permission)
Walsh said that the Micro and Nano Technology Commercialization Education Foundation had already produced a MEMS Roadmap in 1998 and another in 2004, but was branching out into a third-generation roadmap called the TSensor Systems Roadmap that included both MEMS and non-MEMS sensor types, their infrastructure and system-level behaviors including the software that they need to work together efficiently. That required reimagining the roadmap as a landscape, according to Walsh.
To read the rest of this article, visit EBN sister site EE Times.