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Roger Grace Announces Call for Abstracts for Printed/Flexible/Stretchable & Functional Fabric Sensors Symposium for Wearables & IoT Applications Session at Sensors Expo 2019

Naples, FL   Roger Grace, President of Roger Grace Associates, the leading marketing consultancy specializing in Sensors and MEMS has announced the call for abstracts for the all-day June 25, 2019 Sensors Expo pre-conference symposium. Abstract deadline is March 1, 2019. The session will address Printed/Flexible Stretchable (P/F/S) and Functional Fabric (FF) Sensors from a commercialization perspective to support Internet of Things (IoT) and wearable applications. Mr. Grace will be joined by other world recognized leaders in the P/F/S and FF sensors and electronics area representing organizations from the US, Europe and Asia who will present information on current research and development activities, application opportunities and manufacturing methods and challenges for P/S/T and FF sensors and P/S/T and FF Sensor-based systems issues. The expo and technical conference will take place at the McEnery San Jose California Convention Center from June 26-27, 2019.

Mr. Grace stated, “This all-day symposium is a key and integral part of my “evangelization” of P/F/S and FF sensors. It was developed to help inform and educate the technical, technical management, and business community of the major significance of P/S/T and FF sensor-based technologies and their enabled far- reaching opportunities in IoT and wearable applications from both a current and future perspective. Attendees will be provided with presentations from representatives of leading international organizations representing the entire ecosystem of P/S/T and FF sensors and associated electronics, from research and development to manufacturing, who are in the forefront of bringing new and unique P/S/T and FF technologies to the market. We are expecting that several speakers from leading international research and development organizations and universities will address their efforts on device development and integration issues and future application opportunities. Presentations will address the current and future opportunities for P/F/S and FF sensors and the necessary requirements for them to become commercially viable.  Also, to be addressed will be other functional elements of these IoT and wearable systems e.g. batteries, memory/logic as well as packaging and interconnects. Barriers to the successful commercialization and strategies resulting in monetization of P/S/T and FF sensors strategies from perspectives including integration, infrastructure and manufacturing will be addressed. The symposium will also address the requisite infrastructure of materials, manufacturing and test systems. We expect the attendee to emerge from the session with a good knowledge of where we have come from, where we are, where we’re going, and what they need to do to help create a more commercially viable P/S/T and FF sensor industry as well as where they can participate in exploiting current and future major application opportunities for P/S/T sensors.” He concluded, “This Sensors 2019 pre-conference symposium has, to the best of my knowledge, the most highly concentrated and expansive effort to date to exclusively address the topic of P/F/S and FF sensors”.

Mr. Cal Groton, Group Director at Questex, the organizer of the event said, “We decided early on in the creation of the pre-conference program to address IoT and wearables because of its current and future importance in the sensors space. Our decision to bring Roger Grace aboard to develop and chair an all-day pre-conference symposium was an easy one for us based on Roger’s well- deserved reputation in the industry as a sensors marketing consultant “guru “in addition to his long and successful track record of developing over 25 successful technical conference sessions, many here at Sensors Expo. We are truly gratified that Roger’s selection of speakers for his all-day session on printed/flexible/stretchable sensors demonstrates the intent of our exciting conference…that being informing and educating the engineering community as to the power and capability of sensor technology to solve application opportunities. We are looking forward to very successful technical sessions, technical exhibit and especially Roger’s star-studded array of speakers in our pre-conference program”.


The availability of sensors that can take the shape and work reliably in their imposed complex and demanding working environment has existed for quite some time.   Interlink Electronics and Tekscan introduced their flexible sensor product lines in the mid-80’s.  With the recent popularity of the Internet of Things (IoT), “wearables” (including clothing) and more importantly…disposables…create the need for low-cost single or multiple sensors per system that are small, lightweight and low- power consuming that also can conform to the shape of and survive the environment in which they must operate and are becoming essential.  This is especially relevant in the creation of measurement systems which typically rely upon several sensors and their accompanying microcontroller/embedded sensor fusion algorithms that make them “smart” and enable them to address a myriad of IoT applications including environmental/pollution monitoring including air, water, soil and food; fitness; health /e-health monitoring; agriculture and other applications supporting the “four pillars” of Abundance…the solution….printed/flexible/stretchable sensors and associated electronics and packaging.    Recent estimates report the total market for printed/flexible sensors to be $8 billion of the $340 billion flexible electronics market by 2025.  With expected unit average sales prices (ASPs) of approximately $0.01 by 2025, this translates into an annual 800-billion-unit volume market…and certainly qualifies as a significant constituent of the trillion sensors initiative.

The US DOD has recently awarded major contracts to organizations to move these two important technologies forward. Headed by MIT, the Advanced Functional Fabrics of America (AFFOA) Program received $75 million in funding matched with $242 from many participating organizations in late April, 2016.  In August 2015, the FlexTech Alliance received $75 million from DOD with matching grants of $96 million from organizations to create and manage a flexible hybrid electronics facility in San Jose California.

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