Today’s automotive industry is changing at an incredibly fast pace, moving from combustion engine-based designs with human drivers to driverless, electronics-based systems. This automotive transformation presents some clear electronic design challenges in the inevitable shift toward the design and production of semi- and fully autonomous vehicles.
At the electronic component level, miniaturization will be achieved in part by hi-density interconnect (HDI) technology. HDI – a mature technology previously adopted by early smartphone manufacturers – will now enable automotive designers to make both semi- and fully autonomous vehicles a reality, while preserving valuable PCB real estate for additional componentry.
It’s a growing market. The global HDI PCB market generated $9.49 billion in sales in 2017, and is expected to reach at $22.26 billion by 2025, growing at a compound annual growth rate (CAGR) of 11.1% from 2018 to 2025, according to a recent report by Allied Market Research. The consumer segment, including laptops, smartphones, tablets, and wearables, digital cameras and other devices, accounted for the highest share of 42% in 2017. “In the near future, increasing utilization of HDI technology in automobiles is expected to provide lucrative opportunities for the growth of the global HDI PCB market,” the report said.
For automotive electronics, a key design challenge is to shrink the physical footprint of embedded systems, while simultaneously fulfilling the demand for unprecedented connectivity, electrification, infotainment, and autonomous driving capabilities. HDI can help.
Click on the image below to start a slideshow about how automotive designers will be thinking about HDI. This is a primer for buyers who want to know a little more about the market.
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