Wearables Try On Package Options

SANTA CLARA, Calif. – Wearable devices are pushing the boundaries of packaging and interconnects, according to experts who say many of the most interesting innovations are still ahead.

Wearables is a diverse field “with at least ten different segments,” said Pankaj Kedia, a senior director running the emerging wearables product line for Qualcomm. “For fast turn around, system-in-package rather than silicon integration will be more important,” he said on a panel at the Linley Mobile and Wearable Conference here.

Kedia would not say what sorts of SiP products Qualcomm is delivering. But he did note the recently launched Snapdragon 2100 and 1000 SoCs for wearables keep sensors external and come in versions supporting a variety of communications options.

Likewise Mediatek offers variants of its three SoCs for wearables, some using SiP techniques to support comms and sensor options or, for example, 4 Mbyte memories, said Cliff Lin, a senior director for business development at Mediatek.

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